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Posted: Thursday, December 28, 2017 12:29 PM

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A Career at HARMAN
We are ONE HARMAN.We are greater than the sum of our divisions or brands. We proudly talk about our many iconic brands and describe how our technologies are transforming the car, the workplace and everywhere in between. We work hard. We create useful, playful, beautiful things. We strive for excellence and we aim to win as a team. No matter the position, every employee at HARMAN is expected to demonstrate our core competencies: leadership, change:orientation, collaboration, judgment and a results:driven mindset. At HARMAN, we expect brilliance. You can expect a career full of brilliant possibilities.
Position Summary:
The Senior Reliability Engineer will assess and evaluate solder joint quality and reliability on Harman Printed Circuit Board Assemblies (PCBAs), and predict the solder joint reliability under specific validation test conditions.
Job Responsibilities:
:Evaluate Printed Circuit Board Assemblies with various lab tools according to IPC or customer spec
:Evaluate solder joints on Harman PCBA after reflow, wave or select wave to validate production lines
:Evaluate solder joints in Harman units after validation test to assess solder joint reliability
:Theoretical prediction of solder joint reliability with simulation
:Communicate (written, verbal) analyses results and proposed solutions with PM, Product Development, Test engineering, Process Engineering, Quality (manufacturing, customer, supplier etc.)
:Perform analyses of suspect solder joint; electronic component, and PCBA with a variety of lab tools, including:
:Optical microscope with image capture
:X:ray radiography, including 3D CT
:Scanning Electron Microscope (SEM) and Energy Dispersive X:ray Analysis (EDX)
:Scanning Acoustic Microscope (C:SAM)
:Sample preparation and Cross:section
:Electric tests with Curve Tracer, LCR meter, Multimeter etc.
:Mechanical tests with Instron
Basic Qualifications:
:College degree in a Science or Engineering field
:Minimum 5 years' experience in electronic industry
:Experience in the evaluations of solder joint quality and reliability
:Understanding of electronics assembly processes (reflow, wave soldering, Select wave, etc.)
:Experience or knowledge in electronic components, including printed circuit board, passive components, interconnects and semiconductor devices (discrete and integrated circuits)
:Experience or knowledge in reliability simulation in electronic products
Preferred Qualifications:
:Advanced degrees in a Science or Engineering field
:Experience in reliability simulations of electronic products (Sherlock)
:Experience in a large variety of electronic components
:Experience in solder joint evaluations
Eligibility Requirements:
:Willingness to work in an office in Farmington Hills, Michigan
:Willingness to work in a lab environment with hands:on work on solder joints and theoretic prediction
:Any offer of employment is conditioned upon the successful completion of a background investigation and drug screen
HARMAN (harman) designs and engineers connected products and solutions for automakers, consumers, and enterprises worldwide, including connected car systems, audio and visual products, enterprise automation solutions; and services supporting the Internet of Things. With leading brands including AKG(R), Harman Kardon(R), Infinity(R), JBL(R), Lexicon(R), Mark Levinson(R) and Revel(R), HARMAN is admired by audiophiles, musicians and the entertainment venues where they perform around the world. More than 25 million automobiles on the road today are equipped with HARMAN audio and connected car systems. Our software services power billions of mobile devices and systems that are connected, integrated and secure across all platforms, from work and home to car and mobile. HARMAN has a workforce of approximately 30,000 people across the Americas, Europe, and Asia. In March


• Location: Detroit

• Post ID: 44567637 detroit is an interactive computer service that enables access by multiple users and should not be treated as the publisher or speaker of any information provided by another information content provider. © 2018